Laser Debonding System for Temporary Bonding

Video

• High throughput
• The laser minimizes the cost of operation and maintenance
• Fast release from low power laser
• Full absorption by the coating layer without defect
• Minimum de-bonding stress
• Special release layer
• More adhesive options

 

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Standard Product(s)

LD- Semi Automatic 200/300
● Equipment Dimension: 1,600mm(W)*1,200mm(D)*2,430mm(H)
● Max. Scan Area: 470mm*470mm (4” /8” /12” wafer compatible)
● Scan Time:
　　　1. 4”: 15 sec/wafer
　　　2. 8”: 35 sec/wafer
　　　3. 12”: 70 sec/wafer

LD- Automatic 200/300
● Equipment Dimension: 2,660mm(W)*2,800.5mm(D)*2,087mm(H)
● Max. Scan Area: 470mm*470mm (4” /8” /12” wafer compatible)
● WPH
　　1. 4”: 55 wafers/hour
　　2. 8”: 42 wafers/hour
　　3. 12”: 30 wafers/hour

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Applications

• 2.5D/3D IC TSV
• Chip on Wafer on Substrate (CoWoS)
• Fan Out Wafer Level Package (FOWLP)
• Glass Interposer
• CIS BSI
• III V, RF Compound
• Vertical LED
• Flexible Film Substrate Handling
• Thin Glass Handling
• Panelized TOL

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De-Bonding Process Flow